• Advanced PEEK & PEKK 3D Printing: Material Selection, Crystallization, Warpage & Part Qualification

    Master PEEK and PEKK 3D printing, crystallization, warpage, interlayer bonding, annealing and qualification in this advanced technical training.

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Build More Reliable PEEK and PEKK Parts by Controlling Thermal History, Crystallization, Interlayer Bonding and Qualification

Printing PEEK or PEKK successfully requires far more than reaching a high nozzle temperature. These high-performance PAEK materials are extremely sensitive to thermal history, crystallization kinetics, chamber conditions, interlayer temperature, residual stress and post-processing. Small changes in cooling rate, chamber uniformity, filament condition, deposition temperature or annealing strategy can significantly alter crystallinity, dimensional stability, void content and mechanical performance.


This advanced expert-led training focuses on the materials science and process-control decisions that determine whether a printed PEEK or PEKK component achieves repeatable, qualified performance. Participants will examine how PEEK and PEKK differ in crystallization behaviour, how processing conditions influence morphology and warpage, how interlayer bonding develops, and how thermal history should be controlled from filament preparation through final part qualification.


The training focuses on the relationships between:

Polymer Structure → Melt Behaviour → Thermal History → Crystallization → Residual Stress → Interlayer Bonding → Part Performance


The session is designed for professionals who already understand polymer processing and additive manufacturing fundamentals and want to improve process robustness, part consistency and engineering performance.


What Problems Does This Training Solve?

PEEK and PEKK printing problems are rarely caused by one machine setting. Crystallization, thermal gradients, material condition and deposition history interact throughout the build. This training focuses on practical challenges such as:

  • Controlling crystallization without creating excessive shrinkage or distortion

  • Reducing warpage through better thermal-history and chamber management

  • Improving interlayer bonding while limiting thermal degradation

  • Selecting PEEK or PEKK for the required processing window

  • Managing annealing without compromising dimensional accuracy

  • Establishing repeatable processing and part-qualification criteria


Why Attend?

This session goes beyond machine settings and generic material comparisons. Participants will learn how to:

  • Connect thermal history with crystallization and final part performance

  • Select PEEK or PEKK based on real processing requirements

  • Diagnose warpage through thermal and structural root causes

  • Improve interlayer bonding without creating excessive degradation risk

  • Design annealing strategies around morphology and dimensional stability

  • Build qualification plans for repeatable high-performance printed parts


Who Should Attend?

This advanced training is particularly relevant for:

  • Polymer and materials R&D scientists

  • Additive-manufacturing and process engineers

  • PEEK, PEKK and filament development teams

  • Aerospace, medical and industrial component engineers

  • Application-development and technical-service professionals

  • Quality and part-qualification teams


Training Outline

  • PEEK versus PEKK material selection

  • Crystallization kinetics and thermal history

  • Filament quality and moisture control

  • Melt rheology and extrusion stability

  • Chamber temperature and cooling control

  • Warpage and residual-stress management

  • Interlayer bonding and void reduction

  • Annealing and dimensional stability

  • Reinforced PEEK and PEKK grades

  • Crystallinity and morphology assessment

  • Mechanical anisotropy and durability

  • Process-window development and qualification

  • Case Studies

  • Expert Q&A Session


Develop more reliable PEEK and PEKK parts through better material, thermal and process decisions. Register Now.

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