More Filler Can Lower CTE. It Can Also Destroy Mold Flow.
Epoxy molding compounds used in advanced semiconductor packaging are being asked to do far more than encapsulate and protect a device. They may need to fill narrow gaps around dense package structures, maintain low coefficient of thermal expansion, resist moisture and reflow, limit package warpage, protect fragile interfaces, provide electrical insulation and provide useful thermal conductivity where the package requires it.
Improving one requirement often makes another more difficult. Increasing silica loading can reduce CTE but sharply increase melt viscosity. Raising crosslink density can increase glass transition temperature but may also increase modulus, cure shrinkage and residual stress. Reducing modulus may protect interfaces but compromise dimensional stability. Increasing thermal conductivity may require filler changes that affect flow, density and moldability.
This advanced training focuses on how epoxy molding compounds are formulated around these competing requirements.
The expert-led session goes beyond conventional epoxy chemistry and semiconductor encapsulation basics. The emphasis is on resin architecture, filler packing, molding flow, cure development, warpage, interfacial stress, thermal performance, reliability and practical troubleshooting for modern semiconductor packages.
Why Attend?
Reduce CTE without destroying mold flow
Engineer high-loading filler architectures
Improve multimodal particle packing
Control cure shrinkage and residual stress
Improve advanced-package warpage performance
Diagnose flow, delamination and reliability failures
Who Should Attend?
This advanced training is particularly relevant for:
Epoxy molding compound formulators
Semiconductor packaging material developers
Encapsulant formulation scientists
Advanced packaging R&D teams
Fan-out packaging engineers
HBM packaging material teams
Chiplet packaging developers
SiC power module material teams
GaN device packaging teams
Epoxy resin developers
Silica and functional filler suppliers
Semiconductor molding process engineers
Compression molding specialists
Package reliability engineers
Materials characterization scientists
Electronic materials technical service teams
Product development managers
Application engineers
Semiconductor materials suppliers
Training Outline
How to Convert Package Requirements Into EMC Formulation Targets
Resin Architecture, Crosslink Density and Cure Design
Filler Engineering and Multimodal Particle Packing
Melt Flow, Moldability and Compression Molding
CTE, Cure Shrinkage and Package Warpage
Low-Stress Design, Adhesion and Interface Reliability
Thermal Performance, Insulation and Ionic Cleanliness
Troubleshooting and Corrective EMC Formulation
Expert Q&A on Formulation and Package Failures
A Better EMC Is Not Simply Harder, Hotter or More Highly Filled
Advanced semiconductor packaging requires the molding compound to perform through the entire process:
flow → filling → gelation → cure → cooling → post-mold cure → reflow → thermal cycling → long-term operation
Every formulation decision influences more than one stage.
This training connects those decisions so participants can move beyond isolated material-property targets and develop EMCs around the complete package performance window. Control the filler. Control the cure. Control the package.
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