A Conductive Coating Is Easy. A Reliable 5-Micron Shield Around a Complex Semiconductor Package Is Not.
As semiconductor packages become smaller, denser and more integrated, electromagnetic interference is no longer controlled only with metal cans, board-level shielding or enclosure design.
The shielding material is increasingly moving directly onto the package. That means conductive inks, ultra-thin conformal coatings, selectively deposited shields and conductive trench-fill materials now have to work across molded package surfaces, vertical sidewalls, narrow compartments and increasingly complex System-in-Package architectures.
For R&D teams, the challenge is not simply achieving high conductivity. The material must also wet the package surface, coat vertical geometry consistently, maintain electrical continuity at very low thickness, connect reliably to ground, survive curing without damaging the package and retain shielding performance after reflow, humidity exposure and thermal cycling.
This expert-led advanced training focuses on how package-level EMI shielding materials are actually formulated, deposited, integrated and troubleshot. The session moves beyond conventional EMI theory and generic conductive materials. The emphasis is on the difficult development decisions involved in conductive inks, conformal package coatings, sidewall coverage, compartment shielding, surface preparation, low-temperature cure and long-term reliability.
Why Package-Level EMI Shielding Is Getting Harder
Advanced packages now place processors, memory, RF devices, power electronics and sensors only millimeters apart. External shielding alone is no longer enough, but moving the shield onto the package creates a new set of materials challenges.
A conductive coating may perform perfectly on a flat coupon yet thin out on sidewalls, crack after thermal cycling, lose adhesion after humidity exposure or become too difficult to spray. Compartment-shielding pastes can leave voids inside narrow trenches, while higher operating frequencies expose weaknesses that conventional testing may miss. The challenge is no longer simply conductivity. It is getting formulation, deposition, adhesion, geometry and package reliability to work together.
Why You Should Attend?
Formulate ultra-thin conductive shielding coatings
Improve package sidewall coverage
Engineer reliable compartment shielding
Control conductive-ink deposition behaviour
Optimize low-temperature cure performance
Diagnose shielding reliability failures
Who Should Attend?
This advanced training is particularly relevant for:
Conductive ink formulators
Electronic materials R&D scientists
EMI shielding material developers
Semiconductor packaging engineers
Advanced packaging R&D teams
System-in-Package developers
Conductive coating formulators
Silver ink and paste developers
Electronic adhesive formulators
Molding compound specialists
Package process engineers
Spray-coating process developers
OSAT technical teams
RF packaging engineers
Automotive electronics developers
Materials reliability engineers
Conductive filler suppliers
Technical service specialists
Product development managers
Training Outline
Converting Shielding Requirements Into Material Targets
Choosing the Package Shielding Architecture
Conductive Material Chemistry for Package Shielding
Particle-Filled Inks Versus Metal-Organic Decomposition Systems
Formulating for Ultra-Thin Conformal Shielding
Sidewall Coverage and Three-Dimensional Package Geometry
Ultrasonic Spray and Additive Deposition
Adhesion to Epoxy Molding Compounds
Surface Preparation Before Shielding Deposition
Compartment Shielding Inside SiP Packages
Rheology for Conductive Trench-Fill Materials
Low-Temperature Cure and Package Thermal Budget
Grounding and Electrical Continuity
High-Frequency Package Shielding
Diagnosing Package-Level Shielding Failures
Q&A Session To Clear Doubts
Package-Level Shielding Is No Longer Just an EMC Design Decision. Develop shielding materials that perform beyond the flat test coupon, with reliable thin-film coverage, sidewall conductivity, compartment isolation and package-level durability.Register for the Training
