Getting the W/mK Higher Is Only Half the Formulation Problem
Increasing thermal conductivity is often the obvious target. The real difficulty starts when the filler loading required to reach that target sends viscosity through the roof, destroys dispensability, increases density, traps air, weakens adhesion, creates excessive component stress or makes the material unstable during storage.
Electronic applications rarely need thermal conductivity alone. A useful formulation may also need electrical insulation, controlled rheology, low modulus, thin or variable bondline capability, fast dispensing, predictable cure, vertical stability and resistance to thermal cycling.
This expert-led online training focuses on how to formulate that complete performance window. You will work through the practical formulation decisions behind thermally conductive adhesives, thermal gap fillers, thermal gels and other dispensable thermal interface materials used around electronic components, PCBs, power electronics, control units, semiconductor packages and heat-generating assemblies.
The emphasis is firmly on formulation, filler engineering, processing, troubleshooting and reliability, not on basic heat-transfer theory.
Why You Should Not Miss This Training
This training connects different problems instead of treating thermal conductivity, rheology, adhesion and reliability as separate subjects.
Build conductivity without losing processability
Select fillers beyond datasheet W/mK
Control highly filled formulation rheology
Improve dispersion and particle packing
Reduce settling, voiding and pump-out
Connect bondline design with performance
Diagnose thermal reliability failures
Formulate for real dispensing conditions
You will see how changes in polymer chemistry, filler type, particle morphology, particle-size distribution, surface treatment, loading level, rheology and processing interact with one another, and how to decide what to change when performance moves in the wrong direction.
Who Should Attend?
This advanced training is particularly relevant for:
Electronics adhesive and TIM formulators
Thermal gap filler and thermal gel developers
Epoxy, silicone, PU and acrylate formulators
Electronic materials R&D scientists
Encapsulant and potting compound developers
Semiconductor packaging material teams
Power electronics and EV material developers
Thermally conductive filler and additive suppliers
Application and technical service scientists
Electronics reliability and qualification engineers
Product development and innovation managers
Training Outline
Translating Electronics Requirements into Formulation Targets
Selecting the Right Matrix and Material Architecture
Filler Selection, Particle Engineering and Thermal Pathway Design
High-Loading Formulation and Polymer-Filler Interface Engineering
Rheology, Mixing, Dispersion and Dispensing
Interface and Bondline Engineering
Cure, Mechanical Stress and Long-Term Reliability
Troubleshooting and Corrective Formulation
Formulation Development & Troubleshooting Roadmap
Expert Q&A session To Clear Doubts
Join this expert-led session and take away a practical formulation approach for filler selection, high-loading systems, rheology, dispensing, interface performance and reliability.
Register Now and Build a Better Thermal Formulation Window
